The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2024

Filed:

Mar. 24, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Morten Jensen, Mesa, AZ (US);

Michael Ryan, Fountain Hills, AZ (US);

Srikant Nekkanty, Chandler, AZ (US);

Joe F. Walczyk, Tigard, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 24/67 (2013.01); H01R 12/714 (2013.01); H01R 13/2421 (2013.01); H01R 13/2485 (2013.01); H01R 13/2492 (2013.01);
Abstract

An interconnect that has an electrically conductive layer, where a first and second insulator layers are coupled with the conductive layer. A region of the conductive layer includes an opening of a portion of the first insulator layer the second insulator layer that are adjacent to the region. An electrical connector of a first device is electrically coupled to a portion of the region on a first side of the conductive layer and an electrical conductor of a second device is electrically coupled with a portion of the region on the second side. Also, an interconnect coupled with a substrate that includes a cylinder extending from a side of the substrate with a plate coupled at the end of the cylinder with an opening that includes two or more tabs of the plate extending into the opening to receive a connector.


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