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For the Inventor, By the Inventor

Tigard, OR, United States of America

Joe F Walczyk

USPTO Granted Patents = 30 

 

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal30 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2015-2025

where 'Filed Patents' based on already Granted Patents

30 patents (USPTO):
1. 12482779 - Hybrid backside thermal structures for enhanced ic packages (2025-11-25),
2. 12341281 - Micro socket electrical couplings for dies (2025-06-24),
3. 12136577 - Integrated circuit die packages including a contiguous heat spreader (2024-11-05),
4. 12135460 - Stackable photonics die with direct optical interconnect (2024-11-05),
5. 12087658 - Hybrid thermal interface material (TIM) with reduced 3D thermal resistance (2024-09-10),
6. 12080620 - Additively manufactured structures for heat dissipation from integrated circuit devices (2024-09-03),
7. 12061230 - Active optical plug to optically or electrically test a photonics package (2024-08-13),
8. 12009612 - Dual-sided socket device with corrugation structures and shield structures (2024-06-11),
9. 11948906 - Hybrid backside thermal structures for enhanced IC packages (2024-04-02),
10. 11935860 - Electrical connector with insulated conductive layer (2024-03-19),
11. 11656247 - Micro-coaxial wire interconnect architecture (2023-05-23),
12. 11639556 - Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays (2023-05-02),
13. 11592472 - Thermal switch for rapid thermal coupling and decoupling of devices under test (2023-02-28),
14. 11581237 - Cooling apparatuses for microelectronic assemblies (2023-02-14),
15. 11398414 - Sloped metal features for cooling hotspots in stacked-die packages (2022-07-26),

As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees, and patents, I can certainly help you with that.

Title: The Innovative Works of Inventor Joe F Walczyk

Introduction: Joe F Walczyk, an inventive mind based in Tigard, OR (US), has made significant contributions to the field of technology with a total of 22 patents to his name.

Latest Patents: One of Walczyk's latest patents is the 'Hybrid backside thermal structures for enhanced IC packages'. This patent focuses on enhancing the performance of integrated circuit (IC) die structures by utilizing innovative composite layer materials. Another notable patent is the 'Electrical connector with insulated conductive layer' which explores the integration of insulator layers with an electrically conductive layer for efficient electrical coupling.

Career Highlights: Joe F Walczyk is associated with Intel Corporation, a renowned technology giant known for its advancements in the semiconductor industry. Within Intel, Walczyk has been instrumental in driving innovation and securing patents that push the boundaries of technological progress.

Collaborations: Throughout his career, Joe F Walczyk has collaborated with talented individuals within Intel Corporation. Some of his notable coworkers include Pooya Tadayon and Ronald Michael Kirby, who have collectively contributed to the success of various innovative projects.

Conclusion: In conclusion, Joe F Walczyk stands out as a prominent inventor with a remarkable portfolio of patents, showcasing his dedication to pushing the boundaries of technology. His collaborations within Intel Corporation highlight the significance of teamwork in driving innovation forward.

If you need further assistance or information about innovations, inventions, inventors, patent attorneys, assignees, or patents, feel free to ask!

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