The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Sep. 26, 2018
Intel Corporation, Santa Clara, CA (US);
Zhimin Wan, Chandler, AZ (US);
Chia-Pin Chiu, Tempe, AZ (US);
Pooya Tadayon, Portland, OR (US);
Joe F. Walczyk, Tigard, OR (US);
Chandra Mohan Jha, Tempe, AZ (US);
Weihua Tang, Chandler, AZ (US);
Shrenik Kothari, Chandler, AZ (US);
Shankar Devasenathipathy, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Heat dissipation techniques include using metal features having one or more slanted or otherwise laterally-extending aspects. The metal features include, for example, tilted metal pillars, or metal bodies or fillets having an angled or sloping sidewall, or other metal features that extend both vertically and laterally. Such metal features increase the effective heat transfer area significantly by spreading heat in the in-plane (lateral) direction, in addition to the vertical direction. In some embodiments, slanted trenches are formed in photoresist/mold material deposited over a lower die, using photolithography and a multi-angle lens, or by laser drilling mold material deposited over the lower die. The trenches are then filled with metal. In other embodiments, metal features are printed on the lower die, and then molding material is deposited over the printed features. In any such cases, heat is conducted from a lower die to an upper die and/or an integrated heat spreader.