Chandra Mohan Jha

This inventor holds 35 USPTO granted patents and 12 published patent applications and 1 EPO patent, primarily in Thermal Management. Top assignee: Intel Corporation. Active years: 2016-2025.

USPTO Granted Patents = 35 (Patent Applications = 12)

% Patents Active = 91.4

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 27(Granted Patents)

Location History:

Chandler, AZ (US) (2016 - 2023)
Tempe, AZ (US) (2018 - 2024)

Company Filing History:

35 out of 56,222

Intel Corporation

patents

Years Active: 2016-2025

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Areas of Expertise:

Thermal Management

Integrated Circuit Packages

Heat Spreader

Microelectronic Assemblies

Thermoelectric Devices

Cooling Channels

Thermal Interface Material

3D Stacked Circuits

Solder Array TIM

Die-Level Cooling

Thermal Crosstalk

Thermal Performance

35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12347780 - Integrated circuit package with flipped high bandwidth memory device (2025-07-01),

2. 12341080 - Semiconductor device stack-up with bulk substrate material to mitigate hot spots (2025-06-24),

3. 12205915 - Microelectronic package with solder array thermal interface material (SA-TIM) (2025-01-21),

4. 12191220 - Hybrid interposer of glass and silicon to reduce thermal crosstalk (2025-01-07),

5. 12021016 - Thermally enhanced silicon back end layers for improved thermal performance (2024-06-25),

6. 11978689 - Semiconductor device stack-up with bulk substrate material to mitigate hot spots (2024-05-07),

7. 11894282 - Vented lids for integrated circuit packages (2024-02-06),

8. 11854932 - Package wrap-around heat spreader (2023-12-26),

9. 11837519 - Heatsink cutout and insulating through silicon vias to cut thermal cross-talk (2023-12-05),

10. 11756860 - Semiconductor device stack-up with bulk substrate material to mitigate hot spots (2023-09-12),

11. 11756856 - Package architecture including thermoelectric cooler structures (2023-09-12),

12. 11735552 - Microelectronic package with solder array thermal interface material (SA-TIM) (2023-08-22),

13. 11705417 - Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level (2023-07-18),

14. 11694942 - Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management (2023-07-04),

15. 11670561 - 3D buildup of thermally conductive layers to resolve die height differences (2023-06-06),

Title: The Innovative Journey of Chandra Mohan Jha

Introduction: Chandra Mohan Jha, a talented inventor based in Chandler, AZ, has made significant contributions to the field of technology with his creative solutions and groundbreaking ideas.

Latest Patents: Chandra Mohan Jha holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a background in engineering and a passion for problem-solving, Chandra Mohan Jha has worked in various tech companies, leading research and development teams to bring cutting-edge products to the market.

Collaborations: Throughout his career, Chandra Mohan Jha has collaborated with top researchers, engineers, and scientists from renowned universities and research institutions, fostering a culture of innovation and excellence.

Conclusion: Chandra Mohan Jha's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true visionary in the world of inventions. His impact on the industry is profound, and his legacy will continue to inspire future generations of inventors.