logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11837519 B1

PDFFull Text
Date of Patent:
Dec. 05, 2023

Filed:

Feb. 06, 2020

Heatsink cutout and insulating through silicon vias to cut thermal cross-talk

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Zhimin Wan, Portland, OR (US);

Chia-Pin Chiu, Tempe, AZ (US);

Chandra Mohan Jha, Tempe, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

Hoa B Trinh

Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2023.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/5386 (2013.01); H01L 25/0652 (2013.01); H01L 23/49816 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 2224/16221 (2013.01);
Abstract

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises an interposer, a first die attached to the interposer, and a second die attached to the interposer. In an embodiment, the electronic package further comprises a heatsink thermally coupled to the first die and the second die. In an embodiment, the heatsink has a first surface facing away from the first die and the second die and a second surface facing the first die and the second die. In an embodiment, the heatsink comprises a thermal break between the first die and the second die.

Find Patent Forward Citations

Wan, Zhimin. (2023). Heatsink cutout and insulating through silicon vias to cut thermal cross-talk (U.S. Patent No. 11837519). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11837519

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…