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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11756856 B1

PDFFull Text
Date of Patent:
Sep. 12, 2023

Filed:

Oct. 02, 2018

Package architecture including thermoelectric cooler structures

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Krishna Vasanth Valavala, Chandler, AZ (US);

Ravindranath Mahajan, Chandler, AZ (US);

Chandra Mohan Jha, Chandler, AZ (US);

Kelly Lofgreen, Phoenix, AZ (US);

Weihua Tang, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Essential Patents Group, LLP

Primary Examiner:

Laura M Menz

Assistant Examiner:

Candice Chan

Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 23/38 (2006.01); H01L 29/43 (2006.01); H01L 25/18 (2023.01); H10N 10/17 (2023.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); H01L 23/3114 (2013.01); H01L 23/38 (2013.01); H01L 25/18 (2013.01); H01L 29/43 (2013.01); H10N 10/17 (2023.02);
Abstract

Embodiments include a microelectronic device package structure having a first die on the substrate. One or more additional dice are on the first die, and a thermal electric cooler (TEC) is on the first die adjacent at least one of the one or more additional dice. A dummy die is on the TEC, wherein the dummy die is thermally coupled to the first die.

Find Patent Forward Citations

Valavala, Krishna. (2023). Package architecture including thermoelectric cooler structures (U.S. Patent No. 11756856). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11756856

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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