The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Jun. 27, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Steven A. Klein, Chandler, AZ (US);
Zhimin Wan, Chandler, AZ (US);
Chia-Pin Chiu, Tempe, AZ (US);
Shankar Devasenathipathy, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01R 12/71 (2011.01); H01R 13/73 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 23/427 (2013.01); H01R 12/716 (2013.01); H01R 13/73 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4087 (2013.01);
Abstract
A microprocessor mounting apparatus comprising a microprocessor socket on a printed circuit board (PCB) and a bolster plate surrounding a perimeter of the microprocessor socket. The bolster plate has a first surface adjacent to the PCB, and a second surface opposite the first surface. A heat dissipation device is on the second surface of the bolster plate. The heat dissipation interface is thermally coupled to the microprocessor socket.