The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Mar. 22, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Zhimin Wan, Chandler, AZ (US);

Steven A. Klein, Chandler, AZ (US);

Chia-Pin Chiu, Tempe, AZ (US);

Shankar Devasenathipathy, Tempe, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01); H01R 12/70 (2011.01); H01R 13/50 (2006.01); H01R 13/24 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01R 12/7076 (2013.01); H01R 12/716 (2013.01); H01R 13/24 (2013.01); H01R 13/50 (2013.01);
Abstract

An integrated circuit (IC) socket comprising a housing with a land side, an opposing die side, and sidewalls around a perimeter of the housing. The housing comprises a first dielectric. A plurality of socket pins extends from the land side of the housing through socket pin holes in the housing over the die side of the housing. A second dielectric is within the interstitial regions between the socket pins and sidewalls of the socket pin holes. A frame structure extends around at least a portion of the perimeter of the housing, and a mesh structure is embedded within the first dielectric. The mesh structure has plurality of mesh filaments extending between the plurality of socket pin holes and coupled to the frame structure.


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