The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Jan. 17, 2024
Intel Corporation, Santa Clara, CA (US);
Rahul Jain, Gilbert, AZ (US);
Kyu Oh Lee, Chandler, AZ (US);
Siddharth K. Alur, Chandler, AZ (US);
Wei-Lun K. Jen, Chandler, AZ (US);
Vipul V. Mehta, Chandler, AZ (US);
Ashish Dhall, Chandler, AZ (US);
Sri Chaitra J. Chavali, Chandler, AZ (US);
Rahul N. Manepalli, Chandler, AZ (US);
Amruthavalli P. Alur, Tempe, AZ (US);
Sai Vadlamani, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.