The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Sep. 28, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Junnan Zhao, Gilbert, AZ (US);

Ying Wang, Chandler, AZ (US);

Cheng Xu, Chandler, AZ (US);

Kyu Oh Lee, Chandler, AZ (US);

Sheng Li, Gilbert, AZ (US);

Yikang Deng, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 27/255 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 27/255 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0066 (2013.01);
Abstract

Described herein are magnetic core inductors (MCI) and methods for manufacturing magnetic core inductors. A first embodiment of the MCI can be a snake-configuration MCI. The snake-configuration MCI can be formed by creating an opening in a base material, such as copper, and providing a nonconductive magnetic material in the opening. The inductor can be further formed by forming plated through holes into the core material. The conductive elements for the inductor can be formed in the plated through holes. The nonconductive magnetic material surrounds each conductive element and plated through hole. In embodiments, a layered coil inductor can be formed by drilling a laminate to form a cavity through the laminate within the metal rings of the layered coil inductor. The nonconductive magnetic material can be provided in the cavity.


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