Chandler, AZ, United States of America

Liwei Cheng

USPTO Granted Patents = 6 

Average Co-Inventor Count = 6.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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6 patents (USPTO):

Title: The Innovative Contributions of Liwei Cheng

Introduction

Liwei Cheng is a prominent inventor based in Chandler, AZ (US). He has made significant contributions to the field of microelectronics, holding a total of 6 patents. His work focuses on developing advanced microelectronic assemblies and related devices.

Latest Patents

Liwei Cheng's latest patents include innovative designs for microelectronic assemblies. One of his notable patents is for microelectronic assemblies having conductive structures with different thicknesses on a core substrate. This invention describes a microelectronic assembly that includes a package substrate with a core substrate featuring a first conductive structure of a specific thickness and a second conductive structure of a different thickness. Another significant patent is for dual trace thickness for single layer routing. This patent outlines a package substrate that includes a conductive layer in a dielectric, with traces and via pads of varying thicknesses, enhancing the efficiency of semiconductor packages.

Career Highlights

Liwei Cheng is currently employed at Intel Corporation, where he continues to push the boundaries of microelectronic technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and effective.

Collaborations

Throughout his career, Liwei Cheng has collaborated with talented individuals such as Cheng Xu and Andrew James Brown. These collaborations have fostered innovation and contributed to the successful development of his patented technologies.

Conclusion

Liwei Cheng's contributions to microelectronics through his patents and work at Intel Corporation highlight his role as a leading inventor in the field. His innovative designs continue to shape the future of technology.

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