The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Jan. 11, 2018
Intel Corporation, Santa Clara, CA (US);
Amruthavalli Pallavi Alur, Tempe, AZ (US);
Siddharth K. Alur, Chandler, AZ (US);
Liwei Cheng, Chandler, AZ (US);
Lauren A. Link, Mesa, AZ (US);
Jonathan L. Rosch, Mesa, AZ (US);
Sai Vadlamani, Chandler, AZ (US);
Cheng Xu, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic interconnect may include a substrate. The substrate may include a passageway in the substrate. The passageway may extend from a first surface of the substrate toward a second surface of the substrate. The passageway may be closed at an end of the passageway. The electronic interconnect may include a plated through hole socket coupled to the passageway. The electronic interconnect may include a contact. The contact may include a pin. The pin may be configured to engage with the plated through hole socket. The electronic interconnect may include a solder ball. The solder ball may be coupled to the plated through hole socket.