For the Inventor, By the Inventor

Enter inventor name

Mesa, AZ, United States of America

Jonathan Rosch

This inventor holds 10 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2020-2026.

USPTO Granted Patents = 10 (Patent Applications = 2)

% Patents Active = 90.0

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 7(Granted Patents)

Company Filing History:

10 out of 56,184

Intel Corporation

Years Active: 2020-2026

Loading Chart...

10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12628676 - Device and method of very high density routing used with embedded multi-die interconnect bridge (2026-05-12),

2. 12040276 - Device and method of very high density routing used with embedded multi-die interconnect bridge (2024-07-16),

3. 12014989 - Device and method of very high density routing used with embedded multi-die interconnect bridge (2024-06-18),

4. 11769719 - Dual trace thickness for single layer routing (2023-09-26),

5. 11508662 - Device and method of very high density routing used with embedded multi-die interconnect bridge (2022-11-22),

6. 11495555 - Magnetic bilayer structure for a cored or coreless semiconductor package (2022-11-08),

7. 11276618 - Bi-layer prepreg for reduced dielectric thickness (2022-03-15),

8. 10741947 - Plated through hole socketing coupled to a solder ball to engage with a pin (2020-08-11),

9. 10734358 - Multi-packaging for single-socketing (2020-08-04),

10. 10535590 - Multi-layer solder resists for semiconductor device package surfaces and methods of assembling same (2020-01-14),

As much as I'd love to assist you in that, I specialize in innovations, inventions, inventors, patent attorneys, assignees, and patents. If you have any questions related to these areas, feel free to ask!

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to [email protected]

Loading…