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For the Inventor, By the Inventor

Mesa, AZ, United States of America

Jonathan Rosch

USPTO Granted Patents = 9 

Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:

goldMedal9 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2020-2024

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9 patents (USPTO):
1. 12040276 - Device and method of very high density routing used with embedded multi-die interconnect bridge (2024-07-16),
2. 12014989 - Device and method of very high density routing used with embedded multi-die interconnect bridge (2024-06-18),
3. 11769719 - Dual trace thickness for single layer routing (2023-09-26),
4. 11508662 - Device and method of very high density routing used with embedded multi-die interconnect bridge (2022-11-22),
5. 11495555 - Magnetic bilayer structure for a cored or coreless semiconductor package (2022-11-08),
6. 11276618 - Bi-layer prepreg for reduced dielectric thickness (2022-03-15),
7. 10741947 - Plated through hole socketing coupled to a solder ball to engage with a pin (2020-08-11),
8. 10734358 - Multi-packaging for single-socketing (2020-08-04),
9. 10535590 - Multi-layer solder resists for semiconductor device package surfaces and methods of assembling same (2020-01-14),

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