The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Apr. 30, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jonathan Rosch, Mesa, AZ (US);

Andrew J. Brown, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); B32B 27/12 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 27/38 (2006.01); B32B 27/36 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H05K 1/03 (2006.01); H01L 23/498 (2006.01); H05K 5/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/145 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 27/12 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H05K 1/0366 (2013.01); B32B 2250/02 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/101 (2013.01); B32B 2307/204 (2013.01); B32B 2307/732 (2013.01); B32B 2457/208 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/14 (2013.01); H05K 5/0017 (2013.01);
Abstract

An apparatus is provided which comprises: a woven fiber layer, a first resin layer on a first surface of the woven fiber layer, a second resin layer on a second surface of the woven fiber layer, the second surface opposite the first surface, and the first and the second resin layers comprising cured resin, a third resin layer on the first resin layer, and a fourth resin layer on the second resin layer, the third and the fourth resin layers comprising an uncured resin, and wherein the fourth resin layer has a thickness greater than a thickness of the third resin layer. Other embodiments are also disclosed and claimed.


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