The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Dec. 10, 2018
Intel Corporation, Santa Clara, CA (US);
Cheng Xu, Chandler, AZ (US);
Zhimin Wan, Chandler, AZ (US);
Lingtao Liu, Chandler, AZ (US);
Yikang Deng, Chandler, AZ (US);
Junnan Zhao, Gilbert, AZ (US);
Chandra Mohan Jha, Chandler, AZ (US);
Kyu-oh Lee, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.