The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Oct. 11, 2018
Intel Corporation, Santa Clara, CA (US);
Cheng Xu, Chandler, AZ (US);
Zhimin Wan, Chandler, AZ (US);
Yikang Deng, Chandler, AZ (US);
Junnan Zhao, Gilbert, AZ (US);
Chong Zhang, Chandler, AZ (US);
Chandra Mohan M Jha, Chandler, AZ (US);
Ying Wang, Chandler, AZ (US);
Kyu-oh Lee, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a cavity, and phase change material within the cavity. In an example, the phase change material has a phase change temperature lower than 120 degree centigrade. A die may be coupled to the substrate. In an example, the semiconductor device package structure includes one or more interconnect structures that are to couple the die to the phase change material within the cavity.