The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Sep. 20, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Onur Ozkan, Scottsdale, AZ (US);

Edvin Cetegen, Chandler, AZ (US);

Steve Cho, Chandler, AZ (US);

Nicholas S Haehn, Scottsdale, AZ (US);

Jacob Vehonsky, Gilbert, AZ (US);

Gang Duan, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 72/00 (2026.01);
Abstract

A semiconductor device may include a first plate-like element having a first substantially planar connection surface with a first connection pad and a second plate-like element having a second substantially planar connection surface with a second connection pad corresponding to the first connection pad. The device may also include a connection electrically and physically coupling the first and second plate-like elements and arranged between the first and second connection pads. The connection may include a deformed elongate element arranged on the first connection pad and extending toward the second connection pad and solder in contact with the second connection pad and the elongate element.


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