The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
Apr. 29, 2020
Intel Corporation, Santa Clara, CA (US);
Frederick W. Atadana, Chandler, AZ (US);
Taylor William Gaines, Chandler, AZ (US);
Edvin Cetegen, Chandler, AZ (US);
Wei Li, Chandler, AZ (US);
Hsin-Yu Li, Chandler, AZ (US);
Tony Dambrauskas, Chandler, AZ (US);
Intel Coropration, Santa Clara, CA (US);
Abstract
Disclosed herein are structures and techniques for underfill flow management in electronic assemblies. For example, in some embodiments, an electronic assembly may include a first component, a second component, an underfill on the first component and at least partially between the first component and the second component, and a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees.