Wei Ey Li

Title: **Wei EY Li: Innovator in Semiconductor Packaging**

Introduction

Wei EY Li, based in Paramus, NJ, is a prolific inventor recognized for his significant contributions to the field of semiconductor packaging. With an extensive portfolio of 68 patents, Li has made remarkable advancements that enhance the functionality and efficiency of electronic devices. His work primarily focuses on innovative packaging designs that address modern technological challenges.

Latest Patents

Wei EY Li's latest patents showcase his expertise in advanced semiconductor package architectures. One notable patent is the design of a no mold shelf package which includes a method for forming semiconductor packages. This invention incorporates a plurality of dies on a substrate, surrounded by an encapsulation layer, which is designed to optimize space and thermal performance. Additionally, Li has developed a patent for barrier structures for underfill containment in integrated circuit assemblies. This design enhances the reliability of electronic connections by positioning barrier structures adjacent to the edges of integrated circuit devices, ensuring effective underfill material application.

Career Highlights

Throughout his career, Wei EY Li has held pivotal roles at esteemed companies such as Intel Corporation and Oracle International Corporation. His work in these organizations has significantly influenced the development of semiconductor technologies, contributing to their leadership in the tech industry.

Collaborations

Li has had the opportunity to collaborate with notable professionals in the field, including Ari Wolfe Mozes and Hong Wang. These collaborations have fostered a dynamic exchange of ideas and innovations, leading to groundbreaking advancements in semiconductor packaging solutions.

Conclusion

Wei EY Li continues to be a driving force in the semiconductor industry through his inventive spirit and commitment to innovation. His contributions not only enhance the functionality of electronic devices but also pave the way for future advancements in technology. With a strong foundation of collaborative efforts and a robust patent portfolio, Li stands out as a leading inventor shaping the future of electronic packaging.