Intel Corporation

Oracle International Corporation

Seven Networks, LLC

Amazon Technologies, Inc.

University of Washington

Vmware, Inc.

Genentech, Inc.

International Business Machines Corporation

Apple Inc.

Cisco Technology, Inc.

The University of Texas System

Asm IP Holding B.v.

Rigel Pharmaceuticals, Incorporated

Rawles LLC

Intervideo, Inc.

Wei Ey Li

Ari Wolfe Mozes

Hong Wang

Edvin Cetegen

Ari Backholm

Xinmin Tian

Milind Baburao Girkar

John Thomas Shen

Jacobi Colton Grillo

Perry H Wang

Tony David

Timothy Theodore List

Mitul Bharat Modi

Daniel Kirchhofer

Nicholas S Haehn

Nicholas Neal

Gerolf F Hoflehner

Rakesh Krishnaiyer

Joseph Yarmus

Benoit Dageville

Thierry Cruanes

Vedvyas Shanbhogue

Ram S Viswanath

Robert A Lazarus

Curtis Peter Tom

Sanjoy K Mondal

Yingnan Zhang

Arvind Raman

Daniel J Burdick

Maureen H Beresini

Paul Pedersen

Nicholas Skelton

David J Mackie

Fei Xie

Mark Ultsch

Robert G Mathews

Vincent J Zimmer

Chen Zhang

Rajesh Poornachandran

Eliezer Weissmann

Jason W Brandt

Aram M Lindahl

Justin E Gottschlich

Yan Wu

Omkar G Karhade

Alon Naveh

Ronny Ronen

Nitin A Deshpande

Boris Ginzburg

Koichi Yamada

Dattatraya Kulkarni

Robert William Lyle

Amit Singh Chhetri

Michael Mishaeli

Sairam Agraharam

David Sehr

Todd M Kinsella

Jason Martin

Richard A Hankins

Wai Chung Chu

Jiewen Yao

Joseph T Friel

Chih-Hsiung Liu

John P Shen

J William Mauchly

Konstantin Levit-Gurevich

Hakan Jakobsson

Kavitha Velusamy

Christopher L Rumer

Xavier Francois Brun

Chris J Newburn

Zheng Zhang

Richard Thayer Wales

Mengchu Cai

Darren Brown

Vipin Kumar

Ruiping Li

Yu P Sun

Abhilasha Bhargav-Spantzel

Salmin Sultana

Li Chen

Ramya Gopalan

Manish Dubey

Abhay Kanhere

Vipul V Mehta

Guy C Nicholson

Giri P Mudusuru

Daniel M Lavery

Sanjiv M Shah

Xanthe M Lam

Esfir Natanzon

Ramesh Bhatt

Thomas J Matula

Roni Rosner

Shan Zhong

Taylor W Gaines

Sirish Raghuram

Cecilia Pui Chi Chiu

Jinshi Huang

John Ng

Embodiments include semiconductor packages and a method to form such semiconductor packages. A semiconductor package includes a plurality of dies on a substrate, and an encapsulation layer over the substrate. The encapsulation layer surrounds the dies. The semiconductor package also includes a plurality of dummy silicon regions on the substrate. The dummy silicon regions surround the dies and encapsulation layer. The plurality of dummy silicon regions are positioned on two or more edges of the substrate. The dummy silicon regions have a top surface substantially coplanar to a top surface of the dies. The dummy silicon regions include materials that include silicon, metals, or highly-thermal conductive materials. The materials have a thermal conductivity of approximately 120 W/mK or greater, or is equal to or greater than the thermal conductivity of silicon. An underfill layer surrounds the substrate and the dies, where the encapsulation layer surrounds portions of the underfill layer.

No mold shelf package design and process flow for advanced package architectures

An integrated circuit assembly may be formed comprising an electronic substrate, a first and second integrated circuit device each having a first surface, a second surface, at least one side extending between the first and second surface, and an edge defined at an intersection of the second surface and the at least one side of each respective integrated circuit device, wherein the first surface of each integrated circuit device is electrically attached to the electronic substrate, an underfill material between the first surface of each integrated circuit device and the electronic substrate, and between the sides of the first and second integrated circuit devices, and at least one barrier structure adjacent at least one of the edge of first integrated circuit device and the edge of the second integrated circuit device, wherein the underfill material abuts the at least one barrier structure.

Barrier structures for underfill containment

Methods for filling a gap feature on a substrate surface are disclosure. The methods may include: providing a substrate comprising one or more gap features into a reaction chamber; and depositing a metallic gap-fill film within the gap feature by performing repeated unit cycles of a cyclical deposition process. Semiconductor structures including metallic gap-fill films are also disclosed.

Methods for filling a gap feature on a substrate surface and related semiconductor structures

Embodiments herein relate to systems, apparatuses, or processes directed to a substrate that includes a first region to be coupled with a die, and a second region separate and distinct from the first region that has a lower thermal conductivity than the first region, where the second region is to thermally insulate the first region when the die is coupled to the first region. The thermal insulation of the second region may be used during a TCB process to increase the quality of each of the interconnects of the die by promoting a higher temperature at the connection points to facilitate full melting of solder.

Substrate with thermal insulation

Disclosed herein are structures and techniques for underfill flow management in electronic assemblies. For example, in some embodiments, an electronic assembly may include a first component, a second component, an underfill on the first component and at least partially between the first component and the second component, and a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees.

Underfill flow management in electronic assemblies

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Microelectronic structures including bridges

A method for conserving device and/or network resources is provided herein. The method includes detecting a wakelock operating on a mobile device and determining a consumption of one of a power or radio usage attributed to the detected wakelock. The method further includes determining a criticality related to user experience for the detected wakelock and releasing the detected wakelock based on the determined consumption and criticality. Related systems and mobile devices are also disclosed.

Method for power saving in mobile devices by optimizing wakelocks

The present invention provides a plasma generating system that includes: a waveguide; a plasma cavity coupled to the waveguide and configured to generate a plasma therewithin by use of microwave energy; a hollow cylinder protruding from a wall of the waveguide and having a bottom cap that has an aperture; a detection unit for receiving the light emitted by the plasma through the aperture and configured to measure intensities of the light in an ultraviolet (UV) range and an infrared (IR) range; and a controller for controlling the detection unit.

Optical system for monitoring plasma reactions and reactors

Methods, systems, articles of manufacture and apparatus to detect process hijacking are disclosed herein. An example apparatus to detect control flow anomalies includes a parsing engine to compare a target instruction pointer (TIP) address to a dynamic link library (DLL) module list, and in response to detecting a match of the TIP address to a DLL in the DLL module list, set a first portion of a normalized TIP address to a value equal to an identifier of the DLL. The example apparatus disclosed herein also includes a DLL entry point analyzer to set a second portion of the normalized TIP address based on a comparison between the TIP address and an entry point of the DLL, and a model compliance engine to generate a flow validity decision based on a comparison between (a) the first and second portion of the normalized TIP address and (b) a control flow integrity model.

Methods, systems, articles of manufacture and apparatus to detect process hijacking

Voice-controlled devices that include one or more speakers for outputting audio. In some instances, the device includes at least one speaker within a cylindrical housing, with the speaker aimed or pointed away from a microphone coupled to the housing. For instance, if the microphone resides at or near the top of the cylindrical housing, then the speaker may point downwards along the longitudinal axis of the housing and away from the microphone. By pointing the speaker away from the microphone, the microphone will receive less sound from the speaker than if the speaker were pointed toward the microphone). Because the voice-controlled device may perform speech recognition on audio signals generated by the microphone, less sound from the speaker represented in the audio signal may result in more accurate speech recognition, and/or a lesser need to perform acoustic echo cancelation (AEC) on the generated audio signals.

Audio assemblies for electronic devices

The present invention provides a plasma generating system that includes: a programmable logic controller (PLC) and a plurality of reactor systems coupled to the PLC by a daisy chain network. Each of the plurality of reactor systems include: a microwave generator for generating microwave energy; and a power supply for providing electrical power to the microwave generator and including a controller, where the controller comprises: at least one microprocessor; and a module communicatively coupled to the at least one processor and including at least one of digital input-output (DIO) and analogue input-output (AIO).

Systems for controlling plasma reactors

A server and method for converting a textual data prompt embedded within a graphical user interface (GUI) to a widget. Parameters of a textual data prompt, which was previously received from a first computing device, are compared to additional parameters associated with widget. A first match and a second match between the parameters and the additional parameters associated with a first widget and a second widget, respectively, of the widgets is identified. In response to determining that a percentage of the first match exceeds a confidence threshold and a percentage of the second match fails to exceed the confidence threshold, the first widget embedded within the GUI on a second computing device is generated. A first response to the textual data prompt by a user associated with the second computing device is received. The first response is displayed as textual data embedded within the GUI of the first computing device.

Automatically converting a textual data prompt embedded within a graphical user interface (GUI) to a widget

The invention provides PCSK9 inhibitors, compositions comprising the PCSK9 inhibitors, and methods of identifying and using the PCSK9 inhibitors.

Compositions and methods for treating cardiovascular disease

Membranes and methods of making and using the membranes are described herein. The membranes can include a foamed polymeric support and a plurality of inorganic particles disposed within the foamed polymeric support. The foamed polymeric support can contain a hydrophilic polymer such as polyethersulfone. The plurality of inorganic particles can include hydrophilic particles such as zeolite particles. In certain embodiments, the membrane can be used in humidifiers, such as those used in fuel cell systems. In some aspects, the membrane can be used for separating a fluid mixture comprising water. The membranes described herein are stable for high temperature applications.

High temperature humidification membranes

Growing community of inventors

Paramus, NJ, United States of America

Wei Ey Li