Wei Wei

Title: Innovations by Inventor Wei Wei in Semiconductor Technology

Introduction

Wei Wei is an accomplished inventor based in Chandler, AZ, recognized for his contributions to semiconductor technology. With a patent to his name, Wei has focused on advancing the field of electronic interconnects, providing innovative solutions for the industry.

Latest Patents

Wei Wei holds a patent for an "Omni directional interconnect with magnetic fillers in mold matrix." This patent entails various embodiments related to the methods of creating omni-directional semiconductor interconnect bridges. The innovation includes semiconductor assemblies characterized by a mold layer that incorporates a mold material along with a first filler material. Additionally, a second filler material is heterogeneously dispersed within the mold material, enhancing the functionality and performance of the assemblies.

Career Highlights

Wei Wei is currently affiliated with Intel Corporation, a leader in semiconductor manufacturing and technology innovation. Throughout his career at Intel, he has contributed significantly to research and development efforts, focusing on improving electronic interconnect technologies.

Collaborations

In his research endeavors, Wei collaborates with fellow inventor Bohan Shan. Together, they work on pioneering advancements in semiconductor technology, pushing the boundaries of innovation and contributing to the ongoing development of integrated circuit solutions.

Conclusion

Wei Wei's innovative work in the semiconductor sector showcases the impactful contributions of inventors in driving technological advancements. His patent on omni directional interconnect with magnetic fillers illustrates the importance of research and collaboration in creating efficient electronic systems. As he continues his journey at Intel Corporation, Wei plays a vital role in shaping the future of semiconductor technology.