Intel Corporation

Wei Wei

Kristof Darmawikarta

Jeremy D Ecton

Gang Duan

Suddhasattwa Nad

Dingying David Xu

Xiaoying Guo

Kyle Jordan Arrington

Bai Nie

Jung Kyu Han

Hongxia Feng

Srinivas Venkata Ramanuja Pietambaram

Jieying Kong

Haobo Chen

Bohan Shan

Ala Omer

Yue Deng

Yi Yang

Christy Sennavongsa

Ao Wang

Santosh Tripathi

Substrate assemblies having adhesion promotor layers and related methods are disclosed. An example apparatus includes a substrate, a dielectric layer, a first copper layer between the substrate and the dielectric layer, and a film between the dielectric layer and the first copper layer. The film including silicon and nitrogen and being substantially free of hydrogen. A via in the dielectric layer is to provide access to the first copper layer. A portion of the first copper layer uncovered in the via, a wall of the via and the portion of the first copper layer to be substantially free of fluorine. A seed copper layer positioned on the dielectric layer. The via wall and the portion of the first copper layer. The seed copper layer and the first copper layer define an undercut at an interface between the seed copper layer and the first copper layer.

Substrates having adhesion promotor layers and related methods

Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.

Omni directional interconnect with magnetic fillers in mold matrix

Growing community of inventors

Chandler, AZ, United States of America

Wei Wei