Portland, OR, United States of America

Santosh Tripathi

USPTO Granted Patents = 1 

Average Co-Inventor Count = 15.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):

Title: **Inventor Spotlight: Santosh Tripathi**

Introduction

Santosh Tripathi is an innovative inventor based in Portland, Oregon, USA. Known for his contributions to the field of semiconductor technology, he has made significant advancements through his patented invention.

Latest Patents

Santosh Tripathi holds a patent for an "Omni directional interconnect with magnetic fillers in mold matrix." This invention involves various embodiments related to methods for creating omni-directional semiconductor interconnect bridges. The patent describes semiconductor assemblies that feature a mold layer containing mold material, alongside a first and second filler material, with the second filler material being heterogeneously dispersed within the mold matrix.

Career Highlights

He is currently associated with Intel Corporation, a leading technology company known for its processors and semiconductor innovations. Within his role, Tripathi leverages his expertise to push the boundaries of semiconductor manufacturing and connectivity solutions.

Collaborations

In his professional journey, Santosh collaborates closely with his coworker, Bohan Shan. Together, they contribute to projects that focus on enhancing semiconductor technologies and innovations at Intel Corporation.

Conclusion

Santosh Tripathi stands out as an inventor with a keen vision for advancing technology in the semiconductor industry. His patent reflects a commitment to innovation, and his work at Intel Corporation continues to pave the way for future advancements in the field.

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