Intel Corporation

Yue Deng

Gang Duan

Jung Kyu Han

Kristof Darmawikarta

Rahul N Manepalli

Jeremy D Ecton

Dingying David Xu

Xiaoying Guo

Kyle Jordan Arrington

Bai Nie

Hongxia Feng

Srinivas Venkata Ramanuja Pietambaram

Haobo Chen

Bohan Shan

Wei Wei

Santosh Tripathi

Liang He

A computer apparatus includes a hierarchy of solder joints in a multi-chip package, with solder joints at different levels of the packaging having different melting temperatures. Interconnections, such as pads or pins, on integrated circuit (IC) die can be electrically coupled to ends of contact pillars with solder joints having a higher melting temperature. The other ends of the contact pillars can electrically couple to another substrate or another device with solder joints having a lower melting temperature. The contact pillars can be, for example, a contact array or through-hole via in a substrate.

Solder interconnect hierarchy for heterogeneous electronic device packaging

Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.

Omni directional interconnect with magnetic fillers in mold matrix

Growing community of inventors

Chandler, AZ, United States of America

Yue Deng