The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Jul. 01, 2022
Intel Corporation, Santa Clara, CA (US);
Jeremy Ecton, Gilbert, AZ (US);
Aleksandar Aleksov, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Robert A. May, Chandler, AZ (US);
Brandon Marin, Gilbert, AZ (US);
Benjamin Duong, Phoenix, AZ (US);
Suddhasattwa Nad, Chandler, AZ (US);
Hsin-Wei Wang, Chandler, AZ (US);
Leonel Arana, Phoenix, AZ (US);
Darko Grujicic, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
IC die package routing structures including a bulk layer of a first metal composition on an underlying layer of a second metal composition. The lower layer may be sputter deposited to a thickness sufficient to support plating of the bulk layer upon a first portion of the lower layer. Following the plating process, a second portion of the lower layer may be removed selectively to the bulk layer. Multiple IC die may be attached to the package with the package routing structures responsible for the transmission of high-speed data signals between the multiple IC die. The package may be further assembled to a host component that conveys power to the IC die package.