Chandler, AZ, United States of America

Hsin-Wei Wang

USPTO Granted Patents = 5 

Average Co-Inventor Count = 7.7

ph-index = 1


Company Filing History:


Years Active: 2019-2024

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5 patents (USPTO):

Title: Hsin-Wei Wang: Innovator in Integrated Circuit Technology

Introduction

Hsin-Wei Wang is a prominent inventor based in Chandler, AZ, known for his contributions to integrated circuit technology. With a total of 5 patents to his name, Wang has made significant advancements in the field, particularly in the area of electronic substrates.

Latest Patents

Wang's latest patents include innovative designs that enhance the functionality and reliability of integrated circuit assemblies. One of his notable inventions is the "Barrier structures for underfill containment," which describes an integrated circuit assembly that incorporates barrier structures to improve underfill material containment. This invention ensures that the underfill material effectively abuts the barrier structures, enhancing the overall performance of the electronic substrate.

Another significant patent is "Conductive route patterning for electronic substrates." This invention outlines a method for forming conductive routes through a sequence of etching and passivation steps. The resulting structure includes an etch stop layer and a passivating layer, which contribute to the efficiency and reliability of integrated circuit assemblies.

Career Highlights

Hsin-Wei Wang is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in electronic technology. His work at Intel has positioned him as a key player in the development of advanced integrated circuits.

Collaborations

Wang has collaborated with notable colleagues, including Jeremy D Ecton and Oscar Ojeda, contributing to a dynamic and innovative work environment at Intel Corporation.

Conclusion

Hsin-Wei Wang's contributions to integrated circuit technology through his patents and work at Intel Corporation highlight his role as a leading inventor in the field. His innovative designs continue to shape the future of electronic substrates and integrated circuits.

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