The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Mar. 29, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Yi Yang, Gilbert, AZ (US);
Rahul N. Manepalli, Chandler, AZ (US);
Suddhasattwa Nad, Chandler, AZ (US);
Marcel Wall, Phoenix, AZ (US);
Benjamin Duong, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H01L 21/48 (2006.01); H01L 23/532 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5329 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/53228 (2013.01); H05K 1/036 (2013.01); H05K 1/111 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0195 (2013.01);
Abstract
Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a plurality of first layers, where the first layers comprise an organic material. In an embodiment, a trace is embedded in the package substrate, and a second layer is over the trace, where the second layer comprises silicon and nitrogen. In an embodiment, the second layer is chemically bonded to the one of the first layers.