This inventor holds 4 USPTO granted patents and 21 published patent applications. Top assignee: Intel Corporation. Active years: 2025-2026.
Company Filing History:
Years Active: 2025-2026
Title: Yi Yang: Innovator in Electronic Packaging Technologies
Introduction
Yi Yang is a prominent inventor based in Gilbert, AZ (US), known for his contributions to electronic packaging technologies. With a total of 4 patents, he has made significant advancements in the field, particularly in improving adhesion in electronic components.
Latest Patents
One of Yi Yang's latest patents is titled "Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for HSIO." This invention includes an electronic package that comprises a package substrate with a plurality of first layers made of organic material. The design features an embedded trace within the substrate, with a second layer of silicon and nitrogen chemically bonded to one of the first layers.
Another notable patent is "Substrates having adhesion promotor layers and related methods." This patent describes substrate assemblies that include a substrate, a dielectric layer, and a first copper layer positioned between the substrate and the dielectric layer. The film in this assembly, which consists of silicon and nitrogen, is designed to be substantially free of hydrogen, enhancing the overall performance of the electronic package.
Career Highlights
Yi Yang is currently employed at Intel Corporation, where he continues to innovate and develop new technologies in electronic packaging. His work focuses on enhancing the reliability and efficiency of electronic components, making significant contributions to the industry.
Collaborations
Throughout his career, Yi Yang has collaborated with talented individuals such as Suddhasattwa Nad and Benjamin Duong. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Yi Yang's work in electronic packaging technologies exemplifies the importance of innovation in the field. His patents reflect a commitment to improving the performance and reliability of electronic components, making him a valuable contributor to the industry.