The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2025
Filed:
Feb. 26, 2021
Intel Corporation, Santa Clara, CA (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Ravindranath V. Mahajan, Chandler, AZ (US);
Rahul N. Manepalli, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic package includes an interposer having an interposer substrate, a cavity that passes into but not through the interposer substrate, a through interposer via (TIV) within the interposer substrate, and an interposer pad electrically coupled to the TIV. The electronic package includes a nested component in the cavity, wherein the nested component includes a component pad coupled to a through-component via. A core via is beneath the nested component, the core via extending from the nested component through the interposer substrate. A die is coupled to the interposer pad by a first interconnect and coupled to the component pad by a second interconnect.