The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Sep. 12, 2023
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Srinivas V. Pietambaram, Chandler, AZ (US);
Tarek Ibrahim, Mesa, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Rahul N. Manepalli, Chandler, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Robert L. Sankman, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5383 (2013.01); H01L 23/481 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); H01L 24/09 (2013.01); H01L 25/0652 (2013.01);
Abstract
A glass substrate houses an embedded multi-die interconnect bridge that is part of a semiconductor device package. Through-glass vias communicate to a surface for mounting on a semiconductor package substrate.
Pietambaram, Srinivas. (2025). Inorganic-based embedded-die layers for modular semiconductive devices (U.S. Patent No. 12300620). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12300620
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile