The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Apr. 03, 2023
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kaveh Hosseini, Livermore, CA (US);
Ravindranath V. Mahajan, Chandler, AZ (US);
Chia-Pin Chiu, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01);
Abstract
A substrate for a multi-chip package includes at least one photonic integrated circuit (PIC) interposer mounted in a cavity in a first major surface. Each PIC interposer is configured to electrically connect with, or optically couple to, a plurality of integrated circuit devices. The substrate further includes at least one optical coupler that is optically coupled to the PIC interposer.