The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Jun. 30, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Stephen Morein, San Jose, CA (US);

Ravindranath Vithal Mahajan, Chandler, AZ (US);

Prashant Majhi, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/24 (2013.01); H01L 24/20 (2013.01); H01L 25/0652 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/215 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/2405 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1443 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/37001 (2013.01);
Abstract

Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a plurality of dies stacked vertically; a trench of dielectric material extending through the plurality of dies; a conductive via extending through the trench of dielectric material; and a plurality of conductive pathways between the plurality of dies and the conductive via, wherein individual ones of the conductive pathways are electrically coupled to the conductive via and to individual ones of the plurality of dies, and wherein the individual ones of the plurality of conductive pathways have a first portion including a first material and a second portion including a second material different from the first material.


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