The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Jun. 29, 2022
Intel Corporation, Santa Clara, CA (US);
Sagar Suthram, Portland, OR (US);
Debendra Mallik, Chandler, AZ (US);
Wilfred Gomes, Portland, OR (US);
Pushkar Sharad Ranade, San Jose, CA (US);
Nitin A. Deshpande, Chandler, AZ (US);
Omkar G. Karhade, Chandler, AZ (US);
Ravindranath Vithal Mahajan, Chandler, AZ (US);
Abhishek A. Sharma, Hillsboro, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of a microelectronic assembly comprise: a plurality of microelectronic sub-assemblies arranged in a coplanar array, each microelectronic sub-assembly having a first side and an opposing second side; a first conductive plate coupled to the first sides of the microelectronic sub-assemblies; and a second conductive plate coupled to the second sides of the microelectronic sub-assemblies. The first conductive plate and the second conductive plate comprise sockets corresponding to each of the microelectronic sub-assemblies, and each microelectronic sub-assembly comprises a first plurality of integrated circuit (IC) dies coupled on one end to a first IC die and on an opposing end to a second IC die; and a second plurality of IC dies coupled to the first IC die and to the second IC die.