The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Mar. 27, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Qing Ma, Saratoga, CA (US);

Johanna M. Swan, Scottsdale, AZ (US);

Robert Starkston, Phoenix, AZ (US);

John S. Guzek, Chandler, AZ (US);

Robert L. Sankman, Phoenix, AZ (US);

Aleksandar Aleksov, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/538 (2006.01); H01L 23/15 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/15 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/09 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01);
Abstract

Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.


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