The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2017

Filed:

Jun. 02, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Qing Ma, Saratoga, CA (US);

Quan A. Tran, Fremont, CA (US);

Robert L. Sankman, Phoenix, AZ (US);

Johanna M. Swan, Scottsdale, AZ (US);

Valluri R. Rao, Saratoga, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H01L 23/15 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/112 (2013.01); H01L 21/4803 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/3675 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 3/4605 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H05K 3/0014 (2013.01); H05K 3/4644 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/025 (2013.01); H05K 2203/0228 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49155 (2015.01);
Abstract

Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.


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