The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Aug. 27, 2021
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Yu-Lin Shih, Kaohsiung, TW;
Chih-Cheng Lee, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
An electronic package is provided. The electronic package includes a first circuit structure, a second circuit structure, and an underfill. The second circuit structure is disposed over the first circuit structure. The underfill is disposed between the first circuit structure and the second circuit structure. An inner portion of the underfill has an inner lateral surface adjacent to and is substantially conformal with a lateral surface of the second circuit structure. A first top end of the inner lateral surface is not level with a top surface of the second circuit structure. An outer portion of the underfill has a second top end higher than the first top end.