Ann Arbor, MI, United States of America

Shailesh N Joshi

This inventor holds 184 USPTO granted patents and 51 published patent applications, primarily in Thermal Management (CPC class H01L23-427). Top assignees: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha, University of Illinois. Active years: 2014-2026.

USPTO Granted Patents = 184 

% Patents Active = 88.0

Average Co-Inventor Count = 2.3

ph-index = 12

Forward Citations = 438(Granted Patents)

Forward Citations (Not Self Cited) = 355(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:


Years Active: 2014-2026

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Areas of Expertise:
Cooling Systems
Thermal Regulation
Electric Vehicles
Power Electronics
Vapor Chambers
Hybrid Cooling
Additive Manufacturing
Fluid Wicking
Metamaterials
Photochromatic Materials
Electrostatic Filters
Origami Structures
184 patents (USPTO):Explore Patents

Title: Shailesh N Joshi: Innovator in Heat-Storing Mechanisms and Power Electronics

Introduction:

Shailesh N Joshi, a renowned inventor based in Ann Arbor, MI, has made significant contributions to the fields of heat-storing mechanisms and power electronics. With an impressive portfolio of 135 patents, Joshi's innovative ideas have shaped the development of electronic assemblies and power devices. This article will delve into Joshi's latest patents, career highlights, collaborations, and showcase his influence on the world of innovations.

Latest Patents:

Joshi's recent patents highlight his expertise in developing phase change heat-storing mechanisms for substrates of electronic assemblies. In one of his latest inventions, he describes an electronic assembly with a substrate containing a heat-storing region embedded within it. This heat-storing region, composed of a phase change material encapsulated by an encapsulating layer, efficiently stores and dissipates heat generated by electronic devices. This novel technology ensures optimal performance and longevity of electronic devices, even under challenging thermal conditions.

Another notable patent focuses on glass-based bonding structures for power electronics. Joshi's invention involves a power electronics module that incorporates a glass layer with strategically placed vias containing electrically and thermally conductive material. By directly bonding power electronic devices to the glass layer and employing a cooling structure, this technology significantly enhances heat dissipation in power electronics applications, improving overall system efficiency and reliability.

Career Highlights:

Throughout his career, Shailesh N Joshi has made notable contributions to several esteemed organizations. He has worked as an innovator at Toyota Motor Engineering & Manufacturing North America, where he played a pivotal role in developing cutting-edge technologies for the automotive industry. Joshi's groundbreaking research and inventions helped advance the performance, reliability, and sustainability of vehicles.

Joshi's association with the University of Connecticut showcases his commitment to academia and research. He actively participated in various collaborative projects, combining his industry experience with academic expertise to drive technological advancements in the field of electronics and engineering.

Collaborations:

As an inventor and innovator, Shailesh N Joshi has frequently collaborated with experts in his field. One of his notable collaborators is Ercan Mehmet Dede, who has shared his passion for advancing heat-storing mechanisms and power electronics. Through their partnership, Joshi and Dede have been instrumental in developing groundbreaking solutions that address critical thermal challenges in electronic devices and power systems.

Conclusion:

Shailesh N Joshi's remarkable journey as an inventor and innovator has left an indelible mark on the realms of heat-storing mechanisms and power electronics. With a vast patent portfolio and expertise in developing cutting-edge technologies, Joshi has significantly influenced the industry. His contributions exemplify a relentless commitment to enhancing thermal management in electronic assemblies and power devices, ultimately driving advancements in multiple sectors.

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