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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Jen-Kuang Fang

USPTO Granted Patents = 46 

Average Co-Inventor Count = 2.6

ph-index = 8

Forward Citations = 189(Granted Patents)


Location History:

  • Pintong Hsien, TW (2002)
  • Kaoshiung, TW (2004 - 2005)
  • Pin Tung Hsien, TW (2005)
  • Pingtung, TW (2004 - 2008)
  • Pingtung Hsien, TW (2000 - 2009)
  • Pingtung County, TW (2010)
  • Kaohsiung, TW (2005 - 2021)

Company Filing History:

goldMedal45 out of 1,867 
 
Advanced Semiconductor Engineering, Inc.
 patents
silverMedal1 out of 1 
 
Adavnaced Semiconductor Engineering Inc.
 patent

Years Active: 2000-2021

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46 patents (USPTO):
1. 11024569 - Semiconductor package device and method of manufacturing the same (2021-06-01),
2. 10818636 - Substrate panel structure and manufacturing process (2020-10-27),
3. 10685934 - Semiconductor package device and method of manufacturing the same (2020-06-16),
4. 10672696 - Semiconductor device package (2020-06-02),
5. 10636745 - Semiconductor package device and method of manufacturing the same (2020-04-28),
6. 10566279 - Package device, semiconductor device, and method for manufacturing the package device (2020-02-18),
7. 10269672 - Semiconductor package device and method of manufacturing the same (2019-04-23),
8. 10224301 - Semiconductor package device and method of manufacturing the same (2019-03-05),
9. 9748196 - Semiconductor package structure including die and substrate electrically connected through conductive segments (2017-08-29),
10. 7726544 - Method of packaging flip chip and method of forming pre-solders on substrate thereof (2010-06-01),
11. 7635610 - Multi-chip stack package and fabricating method thereof (2009-12-22),
12. 7384566 - Fabrication method for printed circuit board (2008-06-10),
13. 7375020 - Method of forming bumps (2008-05-20),
14. 7262497 - Bumpless assembly package (2007-08-28),
15. 7064428 - Wafer-level package structure (2006-06-20),

Title: The Innovative Mind of Jen-Kuang Fang

Introduction:

Jen-Kuang Fang, a prolific inventor hailing from Kaohsiung, Taiwan, is a trailblazer in the field of semiconductor technology. With an impressive portfolio of 46 patents to his name, Fang has made substantial contributions to the industry through his cutting-edge inventions and methodologies.

Latest Patents:

Among his recent patents is the groundbreaking "Semiconductor package device and method of manufacturing the same." This invention features a semiconductor package device comprising a circuit layer, electronic components, and conductive elements, showcasing Fang's expertise in enhancing the efficiency and performance of electronic devices. Additionally, Fang's "Substrate panel structure and manufacturing process" patent demonstrates his innovative approach to creating robust and versatile substrate panel configurations.

Career Highlights:

Fang's remarkable career spans across renowned companies such as Advanced Semiconductor Engineering, Inc. (ASE) – a global leader in semiconductor packaging and testing services. His tenure at ASE has been marked by a series of groundbreaking innovations that have propelled the company to the forefront of the semiconductor industry.

Collaborations:

Throughout his career, Fang has collaborated with esteemed professionals in the field, including his colleagues Chun-Chi Lee and Min-Lung Huang. Together, they have embarked on projects that have pushed the boundaries of semiconductor technology and paved the way for future advancements in the industry.

Conclusion:

In conclusion, Jen-Kuang Fang's unwavering commitment to innovation and his relentless pursuit of excellence have cemented his status as a visionary in the field of semiconductor technology. His groundbreaking patents and collaborative endeavors continue to shape the landscape of the industry, inspiring future generations of inventors and engineers.

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