The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Sep. 27, 2017
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Jen-Kuang Fang, Kaohsiung, TW;
Wen-Long Lu, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor package device comprises an electronic component, a conductive bump and a first conductive layer. The electronic component has a top surface. The conductive bump is disposed on the top surface of the electronic component. The conductive bump includes a main body and a protruding portion. The first conductive layer covers a portion of the protruding portion. The first conductive layer has a first upper surface and a second upper surface. The first upper surface and the second upper surface are not coplanar.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile