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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10566279 B1

PDFFull Text
Date of Patent:
Feb. 18, 2020

Filed:

Jan. 25, 2018

Package device, semiconductor device, and method for manufacturing the package device

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Wen-Long Lu, Kaohsiung, TW;

Jen-Kuang Fang, Kaohsiung, TW;

Min Lung Huang, Kaohsiung, TW;

Chan Wen Liu, Kaohsiung, TW;

Ching Kuo Hsu, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Primary Examiner:

Elias Ullah

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01);
Abstract

A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.

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Lu, Wen-Long. (2020). Package device, semiconductor device, and method for manufacturing the package device (U.S. Patent No. 10566279). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10566279

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