The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Jan. 25, 2018
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Wen-Long Lu, Kaohsiung, TW;
Jen-Kuang Fang, Kaohsiung, TW;
Min Lung Huang, Kaohsiung, TW;
Chan Wen Liu, Kaohsiung, TW;
Ching Kuo Hsu, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.