The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Jul. 05, 2017
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Jen-Kuang Fang, Kaohsiung, TW;
Wen-Long Lu, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/055 (2006.01); H01L 25/065 (2006.01); B23K 35/02 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); B23K 35/025 (2013.01); H01L 23/055 (2013.01); H01L 24/11 (2013.01); H01L 25/0657 (2013.01); B23K 2101/40 (2018.08); H01L 2224/1132 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13239 (2013.01); H01L 2224/13244 (2013.01); H01L 2224/13247 (2013.01); H01L 2224/13269 (2013.01); H01L 2224/13561 (2013.01); H01L 2224/13583 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13666 (2013.01); H01L 2224/13669 (2013.01); H01L 2224/13684 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06582 (2013.01);
Abstract
A semiconductor package device includes a carrier, a first electronic component, and a conductive element on the carrier. The first electronic component is over the carrier. The conductive element is on the carrier and electrically connects the first electronic component to the carrier. The conductive element includes at least one conductive particle and a solder material covering the conductive particle, and the conductive particle includes a metal core, a barrier layer covering the metal core, and a metal layer covering the barrier layer.