Min-Lung Huang

This inventor holds 50 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2002-2018.

USPTO Granted Patents = 50 (Patent Applications = 3)

% Patents Active = 88.0

Average Co-Inventor Count = 2.5

ph-index = 11

Forward Citations = 565(Granted Patents)

Forward Citations (Not Self Cited) = 548(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Koahsiung, TW (2005)
Kaohsiung, TW (2002 - 2018)

Company Filing History:

50 out of 1,962

Advanced Semiconductor Engineering, Inc.

patents

Years Active: 2002-2018

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Areas of Expertise:

Conductive Via

3D Package

Redistribution Layer

Bump Fabrication

Wafer-Level Package

Solder Bump

Under Bump Metallurgy

Chip Packaging

Integrated Circuit

Photoresist Adhesion

Passive Component Mounting

Wafer Surface Treatment

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9960121 - Semiconductor device having conductive via and manufacturing process for same (2018-05-01),

2. 9406552 - Semiconductor device having conductive via and manufacturing process (2016-08-02),

3. 8358001 - Semiconductor device packages, redistribution structures, and manufacturing methods thereof (2013-01-22),

4. 8288853 - Three-dimensional package and method of making the same (2012-10-16),

5. 8193647 - Semiconductor device package with an alignment mark (2012-06-05),

6. 7741152 - Three-dimensional package and method of making the same (2010-06-22),

7. 7642132 - Three-dimensional package and method of making the same (2010-01-05),

8. 7528053 - Three-dimensional package and method of making the same (2009-05-05),

9. 7446404 - Three-dimensional package and method of making the same (2008-11-04),

10. 7420274 - Method for forming a redistribution layer in a wafer structure (2008-09-02),

11. 7375020 - Method of forming bumps (2008-05-20),

12. 7358176 - Screen printing method of forming conductive bumps (2008-04-15),

13. 7271498 - Bump electrodes having multiple under ball metallurgy (UBM) layers (2007-09-18),

14. 7261828 - Bumping process (2007-08-28),

15. 7253519 - Chip packaging structure having redistribution layer with recess (2007-08-07),

Title: The Innovative Journey of Min-Lung Huang

Introduction: Min-Lung Huang, a pioneering inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the world of innovations with his groundbreaking ideas and inventions.

Latest Patents: Min-Lung Huang holds several patents in various fields, including technology, healthcare, and environmental sustainability. His recent patents focus on renewable energy solutions and smart home technologies.

Career Highlights: With a career spanning over two decades, Min-Lung Huang has worked tirelessly to bring his innovative ideas to life. He has been recognized for his contributions to the field of green technology and has received numerous awards for his inventions.

Collaborations: Throughout his career, Min-Lung Huang has collaborated with leading research institutions, universities, and companies to further develop and commercialize his inventions. His collaborative efforts have led to the successful implementation of several groundbreaking technologies in the market.

Conclusion: Min-Lung Huang's passion for innovation and dedication to creating a sustainable future through his inventions make him a true visionary in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators worldwide.