The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Nov. 10, 2009
Min-lung Huang, Kaohsiung, TW;
Wei-chung Wang, Kaohsiung, TW;
Po-jen Cheng, Kaohsiung, TW;
Kuo-chung Yee, Kaohsiung, TW;
Ching-huei Su, Kaohsiung, TW;
Jian-wen Lo, Kaohsiung, TW;
Chian-chi Lin, Kaohsiung, TW;
Min-Lung Huang, Kaohsiung, TW;
Wei-Chung Wang, Kaohsiung, TW;
Po-Jen Cheng, Kaohsiung, TW;
Kuo-Chung Yee, Kaohsiung, TW;
Ching-Huei Su, Kaohsiung, TW;
Jian-Wen Lo, Kaohsiung, TW;
Chian-Chi Lin, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A package comprises a first unit including a semiconductor body, a hole, an isolation layer, a conductive layer and a solder. The semiconductor body has a first surface having a pad and a protection layer exposing the pad. The hole penetrates the semiconductor body. The isolation layer is disposed on the side wall of the hole. The conductive layer covers the pad, a part of the protection layer, and the isolation layer. The lower end of the conductive layer extends to below a second surface of the semiconductor body. The solder is disposed in the hole, and is electrically connected to the pad via the conductive layer. A second unit similar to the first unit and stacked thereon includes a lower end of a second conductive layer that extends to below a second surface of a second semiconductor body and contacts the upper end of the first solder.