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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Ching-Huei Su

USPTO Granted Patents = 28

Average Co-Inventor Count = 7.1

ph-index = 8

Forward Citations = 243(Granted Patents)


Company Filing History:

goldMedal28 out of 1,867 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2001-2012

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28 patents (USPTO):
1. 8288853 - Three-dimensional package and method of making the same (2012-10-16),
2. 7741152 - Three-dimensional package and method of making the same (2010-06-22),
3. 7642132 - Three-dimensional package and method of making the same (2010-01-05),
4. 7528053 - Three-dimensional package and method of making the same (2009-05-05),
5. 7446404 - Three-dimensional package and method of making the same (2008-11-04),
6. 7253519 - Chip packaging structure having redistribution layer with recess (2007-08-07),
7. 7064428 - Wafer-level package structure (2006-06-20),
8. 6989326 - Bump manufacturing method (2006-01-24),
9. 6967153 - Bump fabrication process (2005-11-22),
10. 6927964 - Structure for preventing burnt fuse pad from further electrical connection (2005-08-09),
11. 6921716 - Wafer bumping process (2005-07-26),
12. 6877653 - Method of modifying tin to lead ratio in tin-lead bump (2005-04-12),
13. 6875683 - Method of forming bump (2005-04-05),
14. 6861346 - Solder ball fabricating process (2005-03-01),
15. 6846719 - Process for fabricating wafer bumps (2005-01-25),

Title: Ching-Huei Su: Pioneering Innovation in Three-Dimensional Packaging

Introduction:

In the bustling city of Kaohsiung, Taiwan, inventor Ching-Huei Su stands as a beacon of innovation, with 28 patents to his name and a relentless drive for technological advancement. His work in the field of inventing has not only cemented his reputation but has also inspired future generations to push the boundaries of what is possible in the world of technology.

Latest Patents:

Among Ching-Huei Su's latest patents is the groundbreaking 'Three-dimensional package and method of making the same'. This innovative package revolutionizes semiconductor packaging by utilizing a unique method involving blind holes, conductive layers, and solder to create three-dimensional packages that are not only efficient but also compact.

Career Highlights:

Ching-Huei Su is a key figure at Advanced Semiconductor Engineering, Inc., a company at the forefront of semiconductor innovation. His contributions have played a significant role in shaping the future of semiconductor packaging, making him a respected figure in the industry.

Collaborations:

Collaboration is key in the world of innovation, and Ching-Huei Su is no stranger to working alongside talented individuals. Some of his notable coworkers include Min-Lung Huang and Chao-Fu Weng, who have contributed to the success of his projects and patents.

Conclusion:

In conclusion, Ching-Huei Su's passion for innovation and his pioneering work in three-dimensional packaging have solidified his position as a prominent inventor in the world of technology. His commitment to pushing the boundaries of what is possible serves as an inspiration to all those who seek to make a mark in the field of inventions.

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