The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2005

Filed:

Aug. 15, 2003
Applicants:

Ho-ming Tong, Taipei, TW;

Chun-chi Lee, Kaohsiung, TW;

Jen-kuang Fang, Kaohsiung, TW;

Min-lung Huang, Kaohsiung, TW;

Jau-shoung Chen, Hsinchu Hsien, TW;

Ching-huei Su, Kaohsiung, TW;

Chao-fu Weng, Tainan, TW;

Yung-chi Lee, Kaohsiung, TW;

Yu-chen Chou, Kaohsiung Hsien, TW;

Tsung-hua Wu, Kaohsiung Hsien, TW;

Su Tao, Kaohsiung, TW;

Inventors:

Ho-Ming Tong, Taipei, TW;

Chun-Chi Lee, Kaohsiung, TW;

Jen-Kuang Fang, Kaohsiung, TW;

Min-Lung Huang, Kaohsiung, TW;

Jau-Shoung Chen, Hsinchu Hsien, TW;

Ching-Huei Su, Kaohsiung, TW;

Chao-Fu Weng, Tainan, TW;

Yung-Chi Lee, Kaohsiung, TW;

Yu-Chen Chou, Kaohsiung Hsien, TW;

Tsung-Hua Wu, Kaohsiung Hsien, TW;

Su Tao, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H005/00 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor device with a capability can prevent a burnt fuse pad from re-electrical connection, wherein the semiconductor device includes a bump pad and a fuse pad over a wafer. The fuse pad includes the burnt fuse pad having a gap for electrical isolation. The semiconductor device comprises a dielectric layer, disposed substantially above the burnt fuse pad and filling the gap, and a bump structure, disposed on the bump pad. The foregoing semiconductor device can further comprise a passivation layer, which exposes the bump pad and a portion of the burnt fuse pad. Wherein, the dielectric layer is over the passivation layer, covers the exposed portion of the burnt fuse pad and fills the gap.


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