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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Yu-Chen Chou

USPTO Granted Patents = 16

Average Co-Inventor Count = 10.4

ph-index = 6

Forward Citations = 78(Granted Patents)


Location History:

  • Kaohsiung Hsien, TW (2005)
  • Kaohsiung, TW (2003 - 2006)

Company Filing History:

goldMedal16 out of 1,867 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2003-2006

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16 patents (USPTO):
1. 7064428 - Wafer-level package structure (2006-06-20),
2. 6967153 - Bump fabrication process (2005-11-22),
3. 6927964 - Structure for preventing burnt fuse pad from further electrical connection (2005-08-09),
4. 6877653 - Method of modifying tin to lead ratio in tin-lead bump (2005-04-12),
5. 6861346 - Solder ball fabricating process (2005-03-01),
6. 6846719 - Process for fabricating wafer bumps (2005-01-25),
7. 6756256 - Method for preventing burnt fuse pad from further electrical connection (2004-06-29),
8. 6743707 - Bump fabrication process (2004-06-01),
9. 6732912 - Solder ball attaching process (2004-05-11),
10. 6723630 - Solder ball fabrication process (2004-04-20),
11. 6720244 - Bump fabrication method (2004-04-13),
12. 6713320 - Bumping process (2004-03-30),
13. 6692581 - Solder paste for fabricating bump (2004-02-17),
14. 6673711 - Solder ball fabricating process (2004-01-06),
15. 6664128 - Bump fabrication process (2003-12-16),

Certainly! Here is the article about the inventor Yu-Chen Chou with the given data:

Title: Innovator Spotlight: Yu-Chen Chou Revolutionizing Wafer-Level Packaging

Introduction:

Yu-Chen Chou, a talented inventor based in Kaohsiung, Taiwan, has been making significant strides in the field of wafer-level packaging. With 16 patents to his name, Chou is renowned for his groundbreaking work in developing innovative packaging solutions for electronic devices.

Latest Patents:

Chou's latest patented inventions include a cutting-edge wafer-level package structure and a novel bump fabrication process. The wafer-level package structure is designed to enhance the heat dissipation abilities of electronic components, while the bump fabrication process allows for the creation of spherical bumps on wafers, optimizing connectivity and performance.

Career Highlights:

Currently employed at Advanced Semiconductor Engineering, Inc., Yu-Chen Chou continues to drive advancements in semiconductor packaging technology. His expertise and dedication have led to the successful implementation of cutting-edge solutions in the industry, earning him a reputation as a trailblazer in his field.

Collaborations:

Throughout his career, Chou has collaborated with esteemed colleagues such as Ho-Ming Tong and Chun-Chi Lee. Together, they have worked on various projects aimed at pushing the boundaries of wafer-level packaging and furthering technological innovation in the semiconductor industry.

Conclusion:

In conclusion, Yu-Chen Chou's remarkable contributions to wafer-level packaging technology have positioned him as a true visionary in the field of semiconductor engineering. His inventive spirit, coupled with his commitment to excellence, continues to drive progress and shape the future of electronic packaging solutions.

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