The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2003
Filed:
Feb. 12, 2003
Ho-Ming Tong, Taipei, TW;
Chun-Chi Lee, Kaohsiung, TW;
Jen-Kuang Fang, Pingtung Hsien, TW;
Min-Lung Huang, Kaohsiung, TW;
Jau-Shoung Chen, Hsinchu Hsien, TW;
Ching-Huei Su, Kaohsiung, TW;
Chao-Fu Weng, Tainan, TW;
Yu-Chen Chou, Kaohsiung, TW;
Tsung-Hua Wu, Kaohsiung Hsien, TW;
Su Tao, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
The present invention provides a bump fabrication process. After forming an under bump metallurgy (UBM) layer and bumps in sequence over the substrate, the under bump metallurgy layer that is not covered by the bumps is etched with an etchant. The etchant mainly comprises sulfuric acid and de-ionized water. The etchant can etch the nickel-vanadium layer of the UBM layer without damaging the bumps.