logo

For the Inventor, By the Inventor

Taipei, Taiwan

Ho-Ming Tong

This inventor holds 53 USPTO granted patents, primarily in IC Packaging. Top assignees: Advanced Semiconductor Engineering, Inc., International Business Machines Corporation, Nd-Hi Technologies Lab,inc.. Active years: 1990-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ho-Ming Tong. Retrieved from https://idiyas.com/inventor/ho-ming-tong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 53

% Patents Active = 94.3

Average Co-Inventor Count = 5.0

ph-index = 12

Forward Citations = 888(Granted Patents)

Forward Citations (Not Self Cited) = 880(Dec 10, 2025)


Location History:

  • Yorktown Heights, NY (US) (1990 - 2002)
  • Taipei, TW (2001 - 2012)

Company Filing History:

goldMedal29 out of 1,977 
 
Advanced Semiconductor Engineering, Inc.
 patents
silverMedal19 out of 166,524 
 
International Business Machines Corporation
 patents
bronzeMedal4 out of 9 
 
Nd-Hi Technologies Lab,inc.
 patents
4. 3 out of 305 
 
Etron Technology, Inc.
 patents
5. 1 out of 3 
 
Ase (Shanghai) Inc.
 patents
6. 1 out of 1 
 
Ase Electronics Inc.
 patent
where one patent can have more than one assignee

Years Active: 1990-2026

Loading Chart...
Areas of Expertise:
IC Packaging
Flip Chip Process
Bump Fabrication
High Bandwidth Memory
3D IC Structure
Probe Card System
Thermally Enhanced Package
Wafer-Level Package
Solder Ball Fabrication
Under-Bump Metallurgy
Lead-Free Bump
Circuit Substrate
53 patents (USPTO):Explore Patents
1. 12564049 - Diamond enhanced advanced ICs and advanced IC packages (2026-02-24),
2. 12471296 - High bandwidth memory stack with side edge interconnection and 3D IC structure with the same (2025-11-11),
3. 12469836 - High bandwidth memory stack with side edge interconnection and 3D IC structure with the same (2025-11-11),
4. 12442835 - Probe card system, method of manufacturing probe card system, method of using probe card system (2025-10-14),
5. 8258009 - Circuit substrate and manufacturing method thereof and package structure and manufacturing method thereof (2012-09-04),
6. 8059422 - Thermally enhanced package structure (2011-11-15),
7. 7614888 - Flip chip package process (2009-11-10),
8. 7581666 - Wire-bonding method for wire-bonding apparatus (2009-09-01),
9. 7547575 - Two-stage die-bonding method for simultaneous die-bonding of multiple dies (2009-06-16),
10. 7445944 - Packaging substrate and manufacturing method thereof (2008-11-04),
11. 7064428 - Wafer-level package structure (2006-06-20),
12. 6989326 - Bump manufacturing method (2006-01-24),
13. 6967153 - Bump fabrication process (2005-11-22),
14. 6927964 - Structure for preventing burnt fuse pad from further electrical connection (2005-08-09),
15. 6891360 - Plated probe structure (2005-05-10),

Title: The Innovative Journey of Ho-Ming Tong

Introduction:

Ho-Ming Tong, a visionary inventor hailing from Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents:

Ho-Ming Tong's latest patents include a cutting-edge artificial intelligence algorithm for predictive maintenance in manufacturing processes and a revolutionary wearable device for monitoring vital signs in real-time.

Career Highlights:

With a career spanning over two decades, Ho-Ming Tong has established himself as a pioneer in the tech industry. He has held key positions in leading research institutions and technology companies, driving innovation and pushing the boundaries of what is possible.

Collaborations:

Throughout his career, Ho-Ming Tong has collaborated with top engineers, scientists, and designers from around the globe. His ability to work seamlessly in multidisciplinary teams has led to the development of groundbreaking technologies that have transformed industries.

Conclusion:

In conclusion, Ho-Ming Tong's relentless pursuit of innovation and his passion for creating technology that improves lives have solidified his reputation as a trailblazer in the world of inventions. His work continues to inspire future generations of inventors to push the limits of what is possible in the ever-evolving tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…