The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Jul. 19, 2023
Applicants:

Nd-hi Technologies Lab, Inc., Taipei, TW;

Etron Technology, Inc., Hsinchu, TW;

Inventors:

Ho-Ming Tong, Taipei, TW;

Chao-Chun Lu, Hsinchu, TW;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/20 (2006.01); G01R 3/00 (2006.01); G01R 31/00 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07342 (2013.01); G01R 1/06783 (2013.01); G01R 3/00 (2013.01);
Abstract

A probe card system is provided. The probe card system, including a tester assembly, a probe head body configured to couple with the tester assembly, a first interconnection structure on a first side of the probe head body, and a probe layer structure on the first interconnection structure on the first side of the probe head body which is configured to engage with a wafer under test (WUT). The probe layer structure includes a sacrificial layer in connection with the first interconnection structure, a bonding layer in connection with the sacrificial layer, and a plurality of probe tips each in connection with respective conductive patterns exposed from the bonding layer and electrically coupled to the first interconnection structure. The sacrificial layer allows removal of the bonding layer and the plurality of probe tips via an etching operation. A method of manufacturing a probe card system is also provided.


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