Forward Citations = 0

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4 inventors (with patents filed for the assignee):

Chao-chun Lu (6 out of 27 patents)

Ho-Ming Tong (4 out of 53 patents)

Ho-ming Tong (4 out of 5 patents)

4. Wei Yen (1 out of 1 patent)

9 patents: Sort by Forward Citations

1. 12751308 - Semiconductor package and semiconductor package assembly with edge side interconnection (2026-09-29),

2. 12751289 - Semiconductor package and semiconductor package assembly with edge interconnection and method of forming the same (2026-09-29),

3. 12702009 - Semiconductor device and manufacturing method thereof (2026-08-04),

4. 12696803 - Die package including a semiconductor die having a cavity within which a passive component is positioned, IC package and manufacturing process thereof (2026-07-28),

5. 12593688 - Manufacturing method of diamond composite wafer (2026-03-31),

6. 12564049 - Diamond enhanced advanced ICs and advanced IC packages (2026-02-24),

7. 12471296 - High bandwidth memory stack with side edge interconnection and 3D IC structure with the same (2025-11-11),

8. 12469836 - High bandwidth memory stack with side edge interconnection and 3D IC structure with the same (2025-11-11),

9. 12442835 - Probe card system, method of manufacturing probe card system, method of using probe card system (2025-10-14),

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

9 Patents

#440 in Taipei

#1,550 in Taiwan

Taipei, Taiwan

Nd-Hi Technologies Lab,inc.

Forward Citations = 0

4 inventors:

Chao-chun Lu (6 out of 27 patents)

Ho-Ming Tong (4 out of 53 patents)

Ho-ming Tong (4 out of 5 patents)

4. Wei Yen (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nd-Hi Technologies Lab,inc.. Retrieved from https://idiyas.com/company/nd-hi-technologies-lab

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]